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The War of Chips
- Chip WarTechnology HistoryGlobal Chip IndustryUS-China Confrontation
- Categories:Industries History of Technology Popular Science
- Language:Simplified Ch.
- Publication Place:Chinese Mainland
- Publication date:January,2022
- Pages:440
- Retail Price:59.80 CNY
- Size:（Unknown）
- Text Color:Black and white
- Words:（Unknown）
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Review
Praise from Readers:
“The most complete and comprehensive history of the integrated circuit and chip industry I have read so far.”
“The author controls the pacing of the book very well. The first half covers the global chip scramble; the second half focuses on China’s development in the chip field. It involves a great deal of technological knowledge and business data, showing the author’s absolute dedication.”
“From design software to chip design, from manufacturing equipment to chip fabrication, from the industry chain to marketization… there is still a long way to go.”
“Through this book, looking at the forgotten past of global chipmaking offers much to learn from for exploring the road ahead.”
“The most complete and comprehensive history of the integrated circuit and chip industry I have read so far.”
“The author controls the pacing of the book very well. The first half covers the global chip scramble; the second half focuses on China’s development in the chip field. It involves a great deal of technological knowledge and business data, showing the author’s absolute dedication.”
“From design software to chip design, from manufacturing equipment to chip fabrication, from the industry chain to marketization… there is still a long way to go.”
“Through this book, looking at the forgotten past of global chipmaking offers much to learn from for exploring the road ahead.”
Feature
★ From the perspective of a marketing management expert, this book uses plain language to explain the chip industry chain, technological evolution, and the great-power competition behind it.
★ A panoramic review of the fifty-year global struggle for chip supremacy, answering the question: “Why has a tiny chip become the focal point of great-power rivalry?”
★ Analyzes the potential for “lane-changing overtaking” brought by the end of Moore’s Law, AI, and the Internet of Things, identifying directions such as custom chips and cloud AI processors, offering clear industry trends and strategic insights for investors, professionals, and concerned readers.
★ A panoramic review of the fifty-year global struggle for chip supremacy, answering the question: “Why has a tiny chip become the focal point of great-power rivalry?”
★ Analyzes the potential for “lane-changing overtaking” brought by the end of Moore’s Law, AI, and the Internet of Things, identifying directions such as custom chips and cloud AI processors, offering clear industry trends and strategic insights for investors, professionals, and concerned readers.
Description
Intel, Samsung Electronics, TSMC, Micron, Texas Instruments, Toshiba, NVIDIA, ASML—witness the glory and struggles of the world’s chip industry giants.
SMIC, GigaDevice, AMEC, China Resources Microelectronics, Unigroup Guoxin, Hua Hong Semiconductor, Shanghai Bell, Cambricon—the past and present of China’s chip enterprises are all recorded.
This book tells the history of the global chip industry from the perspectives of corporate competition and national power rivalry.
The book is divided into two parts. The first part, “Global Chip Saga,” mainly describes the development history of the global chip industry and the evolution of the chip industry chain. The second part, “China’s Chip Power,” focuses on the rise of China’s chip industry and the latest developments in the chip industry.
Written for a general audience, the book strives to clearly explain, in plain language, the historical, current, and future development of chip products and markets. It is especially suitable for investors planning to invest in the chip industry, professionals in semiconductors and information technology, and ordinary readers concerned about chip development.
SMIC, GigaDevice, AMEC, China Resources Microelectronics, Unigroup Guoxin, Hua Hong Semiconductor, Shanghai Bell, Cambricon—the past and present of China’s chip enterprises are all recorded.
This book tells the history of the global chip industry from the perspectives of corporate competition and national power rivalry.
The book is divided into two parts. The first part, “Global Chip Saga,” mainly describes the development history of the global chip industry and the evolution of the chip industry chain. The second part, “China’s Chip Power,” focuses on the rise of China’s chip industry and the latest developments in the chip industry.
Written for a general audience, the book strives to clearly explain, in plain language, the historical, current, and future development of chip products and markets. It is especially suitable for investors planning to invest in the chip industry, professionals in semiconductors and information technology, and ordinary readers concerned about chip development.
Author
Yu Sheng
Industry Mentor at the Netherlands Business School, writer specializing in hard‑tech and economic history, strategic consultant, and consumer marketing expert.
He has worked at several globally renowned companies including McDonald’s, ZTE, Yihai Kerry, and Evergrande. He excels in marketing management, corporate management, industry research, and strategic consulting, and is acclaimed as a master writer of technological history masterpieces.
His published representative works include "The War of Chips", "The Chip Wave", "The Empire of Grain and Oil Behind Arawana" and "The War of Mobilephone", which have long dominated the WeChat Reading “masterpiece” rankings.
Industry Mentor at the Netherlands Business School, writer specializing in hard‑tech and economic history, strategic consultant, and consumer marketing expert.
He has worked at several globally renowned companies including McDonald’s, ZTE, Yihai Kerry, and Evergrande. He excels in marketing management, corporate management, industry research, and strategic consulting, and is acclaimed as a master writer of technological history masterpieces.
His published representative works include "The War of Chips", "The Chip Wave", "The Empire of Grain and Oil Behind Arawana" and "The War of Mobilephone", which have long dominated the WeChat Reading “masterpiece” rankings.
Contents
Prologue: Huawei’s Dilemma
Part I: Global Chip Saga
Chapter 1: From Transistor to Chip
Transistors Replace Vacuum Tubes
Texas Instruments and Fairchild Invent the Chip
Chips Move from Military to Civilian Use
Chapter 2: Intel the Memory Company
Moore’s Law Is Proposed
The Birth of Memory and Microprocessors
The Dawn of the Personal Computer Age
Japan’s VLSI Project
Chapter 3: Intel Transitions to CPU
The US-Japan Chip War
Only the Paranoid Survive
Angry AMD and Frustrated IBM
Chapter 4: New Forces in Memory
Micron from the “Potato State”
The Birth of Flash Memory
Samsung Memory Rises
Taiwan’s Memory Industry Follows the Trend
Chapter 5: The Ugly Duckling ASML
Philips’ Lithography Machine Becomes an Industry Joke
ASML Is Founded on April Fool’s Day
Market Breakthrough via AMD
Chapter 6: The Chip Food Chain
The Industrial Technology Research Institute President Forced to Go to Sea
ASML’s Turnaround
The Zeiss Lens Legend
Chapter 7: The US Wins the Gulf War
Japan Says “No”?
Korean Memory Defeats Japan
The Soviet Union Abandoned by Moore’s Law
China Bides Its Time
Chapter 8: The Asian Financial Crisis
Samsung’s Myth of Success: An American-Style Success Story
Hynix Changes Course
Taiwan Memory Industry’s Perilous Prosperity
Chapter 9: The Foundry Battle
Taiwan’s Two Foundry Giants Face Off
AMD Spins Off GlobalFoundries
ASML Solves the Lens Problem
The Dry vs. Wet Lithography War
Chapter 10: The Global Financial Crisis
Elpida’s Troubles
The Great Memory Rout
Memory Market Split Three Ways
Chapter 11: The Twilight of Japanese Chips
Toshiba Sells Flash Memory
The Failure of Japan’s Smartphones and LCD Panels
The Decline of Japan’s Electronics Industry
Part II: China’s Chip Power
Chapter 12: The “Project 909” Story
Partner NEC Is Chosen
Hua Hong NEC Builds a Factory and Introduces Technology
Hua Hong’s Chip Design and Venture Capital
Chapter 13: Designing China’s Chips
Indigenous CPU Development
Where Did Spreadtrum Come From?
The Hanxin Scam
Chapter 14: SMIC in Zhangjiang
Jiang Shangzhou Is a Banner
Zhang Rujing Goes North
A Master Builder’s Masterpiece
Chapter 15: The Darkest Hour of China’s Chips
Jiang Shangzhou’s Four Major Contributions to China’s Chips
SMIC Loses the Lawsuit
Jiang Shangzhou Takes Command in Crisis
Chapter 16: A Decade of Rocky Chip Road
From SiEngine to SiEn
Chengdu Chengxin and Wuhan Xinxin Struggle to Survive
Unigroup Integrates Spreadtrum
Chapter 17: Breakthrough in Mainland China Memory
Yangtze Memory Rises
Fujian Jinhua Shuts Down
Hefei Changxin Breaks the Deadlock
Chapter 18: Passing the 28nm Node
The Invention of the 3D Transistor
TSMC vs. Samsung
The End of Moore’s Law Approaches
Chapter 19: The EUV Lithography Challenge
EUV LLC Solves a Century-Old Problem
The EUV Lithography Machine Debuts
China Cannot Obtain EUV Lithography Machines
Chapter 20: China’s Chips Under Trump’s Pressure
SMIC Races Toward 7nm
Gaps and Potential in China’s Semiconductor Industry
The Politics and Capital Behind Chips
Chapter 21: The New Battlefield for Processors
The Rise of the ARM Architecture
“Constantly Fighting” Lisa Su
The War Between Aunt’s Son and Niece’s Son
Chapter 22: Cloud Computing and AI
The Cloud Computing Showdown
The Battle for Cloud Processors
Lane-Changing Overtaking in AIoT
Epilogue: America’s Chip Anxiety
References
Afterword
Part I: Global Chip Saga
Chapter 1: From Transistor to Chip
Transistors Replace Vacuum Tubes
Texas Instruments and Fairchild Invent the Chip
Chips Move from Military to Civilian Use
Chapter 2: Intel the Memory Company
Moore’s Law Is Proposed
The Birth of Memory and Microprocessors
The Dawn of the Personal Computer Age
Japan’s VLSI Project
Chapter 3: Intel Transitions to CPU
The US-Japan Chip War
Only the Paranoid Survive
Angry AMD and Frustrated IBM
Chapter 4: New Forces in Memory
Micron from the “Potato State”
The Birth of Flash Memory
Samsung Memory Rises
Taiwan’s Memory Industry Follows the Trend
Chapter 5: The Ugly Duckling ASML
Philips’ Lithography Machine Becomes an Industry Joke
ASML Is Founded on April Fool’s Day
Market Breakthrough via AMD
Chapter 6: The Chip Food Chain
The Industrial Technology Research Institute President Forced to Go to Sea
ASML’s Turnaround
The Zeiss Lens Legend
Chapter 7: The US Wins the Gulf War
Japan Says “No”?
Korean Memory Defeats Japan
The Soviet Union Abandoned by Moore’s Law
China Bides Its Time
Chapter 8: The Asian Financial Crisis
Samsung’s Myth of Success: An American-Style Success Story
Hynix Changes Course
Taiwan Memory Industry’s Perilous Prosperity
Chapter 9: The Foundry Battle
Taiwan’s Two Foundry Giants Face Off
AMD Spins Off GlobalFoundries
ASML Solves the Lens Problem
The Dry vs. Wet Lithography War
Chapter 10: The Global Financial Crisis
Elpida’s Troubles
The Great Memory Rout
Memory Market Split Three Ways
Chapter 11: The Twilight of Japanese Chips
Toshiba Sells Flash Memory
The Failure of Japan’s Smartphones and LCD Panels
The Decline of Japan’s Electronics Industry
Part II: China’s Chip Power
Chapter 12: The “Project 909” Story
Partner NEC Is Chosen
Hua Hong NEC Builds a Factory and Introduces Technology
Hua Hong’s Chip Design and Venture Capital
Chapter 13: Designing China’s Chips
Indigenous CPU Development
Where Did Spreadtrum Come From?
The Hanxin Scam
Chapter 14: SMIC in Zhangjiang
Jiang Shangzhou Is a Banner
Zhang Rujing Goes North
A Master Builder’s Masterpiece
Chapter 15: The Darkest Hour of China’s Chips
Jiang Shangzhou’s Four Major Contributions to China’s Chips
SMIC Loses the Lawsuit
Jiang Shangzhou Takes Command in Crisis
Chapter 16: A Decade of Rocky Chip Road
From SiEngine to SiEn
Chengdu Chengxin and Wuhan Xinxin Struggle to Survive
Unigroup Integrates Spreadtrum
Chapter 17: Breakthrough in Mainland China Memory
Yangtze Memory Rises
Fujian Jinhua Shuts Down
Hefei Changxin Breaks the Deadlock
Chapter 18: Passing the 28nm Node
The Invention of the 3D Transistor
TSMC vs. Samsung
The End of Moore’s Law Approaches
Chapter 19: The EUV Lithography Challenge
EUV LLC Solves a Century-Old Problem
The EUV Lithography Machine Debuts
China Cannot Obtain EUV Lithography Machines
Chapter 20: China’s Chips Under Trump’s Pressure
SMIC Races Toward 7nm
Gaps and Potential in China’s Semiconductor Industry
The Politics and Capital Behind Chips
Chapter 21: The New Battlefield for Processors
The Rise of the ARM Architecture
“Constantly Fighting” Lisa Su
The War Between Aunt’s Son and Niece’s Son
Chapter 22: Cloud Computing and AI
The Cloud Computing Showdown
The Battle for Cloud Processors
Lane-Changing Overtaking in AIoT
Epilogue: America’s Chip Anxiety
References
Afterword
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